The accelerometers realized with MEMS technology (Micro-Electro-Mechanic System) are nothing else than miniaturized accelerometers based on a mobile micromechanical structure realized by engraving a silicon substrate with standard photolithographic methods.
The main advantages of these devices are the low production cost (especially for two or three measurement axes) and the presence inside them of the conditioning circuit for the response at low frequencies extended up to the continuous. A MEMS accelerometer provides accurate detection while measuring acceleration, tilt, shock and vibration in the performance-driven application.
The negative aspects of this manufacturing technology impact performance in terms of accuracy and stability, which are currently lower than the best piezoelectric accelerometers. In addition, the coating containers typically used for such devices (the dual in-line packages for integrated circuits) are not suitable for industrial measurements in harsh environments.